Huawei tipped to announce a new chipset this year

Huawei has faced a variety of US restrictions on exports of 5G and other technologies in recent years. Since 2021, the Chinese smartphone brand has relied exclusively on Qualcomm for chipsets. Now, a Chinese tipster has hinted that Huawei is preparing to announce a new chip in the second half of this year. The surprise chip is said to be based on a new packaging technology. The tipster also hints that preparations for Huawei’s Mate X3 foldable smartphone will start in a few days.

A Chinese tipster on Weibo claims That Huawei should bring little surprises this year in the form of a new chip. The upcoming chip with new packaging technology is expected to hit the market in the second half of this year. However, there is no official confirmation from Huawei on the reported details.

American officials had put Huawei on a trading blacklist in 2019. According to a last report According to Reuters, the Biden administration has stopped approving licenses for US companies to export most items to China’s Huawei. California-based Qualcomm has received permission to sell 4G smartphone chips to Huawei in 2020.

The tipster also hints that preparations for the Huawei Mate X3 foldable smartphone will start in two more days. It is expected to come with next-gen satellite connectivity. This advanced communication feature allows users to send and receive short messages via a direct satellite network. The foldable smartphone Huawei Mate X3 is said to be the successor Huawei Mate X2which was launched in February 2021.

The Huawei Mate X3 is expected to run on the latest HarmonyOS 2.0.1 edition and could be powered by a Kirin 9000 4G SoC. The unannounced handset appeared last year with the model number PAL-AL00 at China’s state telecommunications certification body TENAA. The listing suggested 4G connectivity and dual SIM support. It is recommended to pack a 4,500mAh battery. An alleged China Compulsory Certification (3C) listing Recommended support for 66W fast charge.