MediaTek Dimensity 7200 SoC launched for gaming smartphones

MediaTek Dimensity 7200, the chipmaker’s first offering in the new Dimensity 7000 series, was launched on Thursday. According to the company, the chip offers cutting-edge AI imaging capabilities, support for 200-megapixel cameras, and support for sub-6GHz 5G networks, while delivering higher efficiency for longer battery life. This chip also uses the second generation 4nm process from Taiwan Semiconductor Manufacturing Company (TSMC) used in the Dimensity 9200 chips. The company added that the new Dimensity 7200 will power 5G devices that will be launched in the first quarter of 2023.

According to the manufacturer, the company’s new Dimensity 7200 is ideal for slim smartphones MediaTek. The octa-core CPU combines two Arm Cortex-A715 performance cores with up to 2.8 GHz operating speed with six Cortex-A510 efficiency cores with a clock speed of 2.0 GHz. MediaTek’s integrated AI processing unit (APU) is designed to optimize the efficiency of AI tasks and AI fusion processing for more power and performance.

Meanwhile, MediaTek’s HyperEngine 5.0 technology can enable power savings through AI-based Variable Rate Shading (VRS), while CPU and GPU resource optimization offers longer battery life, according to the chipmaker. The chipset includes an Arm Mali G610 MC4 GPU.

The newly introduced chipset supports 200-megapixel main cameras with MediaTek’s Imagiq 765 and a 14-bit HDR ISP (image signal processor). The chipset supports 4K HDR video capture, and MediaTek says users can even capture subjects from two cameras at Full HD resolution while keeping everything in focus with the company’s all-pixel autofocus technology.

MediaTek’s new SoC includes motion-compensated noise reduction for improved night and low-light photography, according to the company. The APU will also support advanced AI camera features, including real-time portrait beautification.

The Dimensity 7200 supports standard sub-6GHz 5G connectivity with up to 4.7Gbps downlink, tri-band Wi-Fi 6E connectivity and Bluetooth 5.3. It also features a fully integrated 5G modem and MediaTek’s 5G UltraSave 2.0 technology suite.

The chipset supports 2CC carrier aggregation and dual 5G SIM with dual VoNR (Voice over New Radio), which the company says offers consistent coverage everywhere.

Meanwhile, the MediaTek Dimensity 7200 SoC also supports UFS 3.1 storage, MediaTek MiraVision Display with support for the latest standards, including HDR10+, CUVA HDR and Dolby HDR. It supports up to Full HD+ displays with 144Hz refresh rates, AI SDR-to-HDR video playback for enhanced multimedia experiences, and Bluetooth LE audio technology and dual-link true wireless stereo audio for wireless earbud support. As already mentioned, the newly launched chipset Dimensity 7200 will be available on new devices in the first quarter of 2023.