Alongside a range of laptop CPUs and GPUs, AMD CEO Dr. Lisa Su also made a variety of announcements on desktop and data center products in her opening keynote at CES 2023 in Las Vegas. The top-end Ryzen 7000 X3D series CPUs with integrated 3D Vcache are considered the world’s most powerful CPUs for gaming, displacing the recently introduced Ryzen 9 7950X at the top of AMD’s stack. There are also new mainstream desktop CPUs with limited overclocking support that AMD promises will hit attractive price points. The new Instinct MI300 is what AMD is calling the world’s first integrated data center chip, combining CPU and GPU cores and more, while the new Alveo A70 plug-in accelerator card leverages the company’s new XDNA AI acceleration architecture.
Based on the sole model of the previous generation with integrated 3D vcache, the Ryzen 7 5800X3D which AMD Touted as the world’s fastest processor for gaming, there are now three choices. The new flagship Ryzen 9 7950X3D features 16 cores and 32 threads with a whopping 144 MB of total cache memory. It has a TDP rating of 120W and a boost speed of 5.7GHz. It is aimed at those who play games and also run heavy content creation workloads. It is said to deliver up to 24 percent better performance in games compared to the previous generation.
There’s also the Ryzen 9 7900X3D with 12 cores and 140MB of cache memory, and the Ryzen 7 7800X3D with eight cores and 104MB of total cache memory. The Ryzen 7000 X3D CPU family will be available in February 2023 and pricing will be announced then.
There are also three new mainstream Ryzen 7000 CPUs aim for the 65 W TDP level. Retail CPUs come with a cooler in the box. The 12-core Ryzen 9 7900 is $429, the 8-core Ryzen 7 7700 is $329, and the Ryzen 5 7600 is $229. All three will go on sale on January 10th.
Su also announced that buyers of select Ryzen 7000 CPUs will receive a free copy Star Wars Jedi: Survivor as soon as it is available.
The Instinct MI300 is considered the world’s first integrated data center chip with CPU, GPU and memory in one package. It features 24 CPU cores based on Zen 4 architecture, CDNA3 computational accelerator architecture and 128GB of HBM3 memory. This chip is based on advanced 3D stacking technology with nine 5nm chiplets on top of four 6nm chiplets. In total, it contains more than 146 billion transistors and is the most complex chip AMD has ever developed. The company claims an 8X increase in performance and 5X efficiency over the previous generation Instinct MI250X HPC accelerator. It should enable faster and cheaper processing of much larger AI models, and consume significantly less power. It will soon be sampled at HPC and AI customers and will be launched in the second half of 2023.
The AMD Alveo A70 is a low-profile add-on card based on the new XDNA AI architecture, which AMD says will scale across products and address multiple segments. Optimized for AI inference and power efficiency, the Alveo A70 is said to be able to be 80 percent more powerful than Nvidia’s competition, in AMD’s own tests. It is now available for pre-order for AI cloud infrastructure developers.
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